NEW DOME LENS SMD
◆ Up to 10X more luminous intensity compared to the flat top-view SMD
◆ Focused beams within a narrow viewing angle of 60°
◆ Dimension: 1.6 x 0.8 x 0.95 mm
Paralight UVC LED共晶制程
在材料方面以倒装晶片搭配高导热氮化铝基板作封装。 氮化铝(AIN)具有优异的导热性(140W/mK-170W/ mK),能耐紫外线光源本身的老化,满足UVC LED高热管理的需求。
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NEW DOME LENS SMD
◆ Up to 10X more luminous intensity compared to the flat top-view SMD
◆ Focused beams within a narrow viewing angle of 60°
◆ Dimension: 1.6 x 0.8 x 0.95 mm
Paralight UVC LED共晶制程
在材料方面以倒装晶片搭配高导热氮化铝基板作封装。 氮化铝(AIN)具有优异的导热性(140W/mK-170W/ mK),能耐紫外线光源本身的老化,满足UVC LED高热管理的需求。
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